1.85 by 1.85mm (.073 by .073") pitch gbx module-to-backplane connector system in 4- and 5-pair columns 75220, 75360 daughtercard assemblies 75235, 75237 backplane signal headers 75341, 75510 backplane power the gbx backplane interconnect system delivers speeds beyond 6.0gbps and high density with up to 69 mated differential channels per inch the gbx connector system provides the speed, density, and low applied cost required by leading-edge backplane applications. it is especially suited for designs that require future speed upgrades by daughtercard replacement into an existing backplane. with a native differential signaling speed of 6.0gbps, the system is well suited for existing and future generations of xaui (10 gigabit attachment unit interface) and in?iband* based systems, in addition to those based on atca** (advanced telecom computing architecture) and oif (optical internetworking forum) chip protocols. internetworking and telecommunication equipment engineers will bene? by the gbx connector s ability to provide not only a high-density, low applied-cost solution in the near term, but also by its electrical performance in upgradeable systems. speeds of 10.0gbps and beyond have been demonstrated with appropriate serdes (serializer / deserializer) devices and board-material selection. this allows system architects freedom-of-design for faster future systems without the worry of backwards compatibility, along with the economy of a common backplane for two generations of equipment. in addition, the gbx l-series system provides a complimentary high-density open pin ?ld for cost- effective design of slower speed circuits along the same stiffener as the standard, high-speed gbx wafers. reference information packaging: daughtercard assemblies ?tube headers -- tray ul file no.: pending csa file no.: pending designed in: mm electrical signal/shield contact current rating: 1.0a contact to plated-through-hole resistance: 1.0 milliohm max. power blade contact resistance: 3.0 milliohms max. dielectric withstanding voltage: 750v rms insulation resistance: 10,000 megohms min. mechanical contact insertion force: 44.48n (10.00 lb) typical per contact contact retention force: 8.90n (2.00 lb) min. per contact mating force: 0.59n (0.13 lb) max. per contact unmating force: 0.29n (0.07 lb) min. per contact durability: 250 cycles max. physical housing: liquid crystal polymer, ul 94v-0 contact: copper alloy plating: contact area ?0.76um (30) gold (au) min. solder tail area ?tin (sn) underplating ?nickel (ni) pcb thickness: 1.60mm (.062? typical operating temperature: -55 to 105 degrees c specifications features and bene?s up to 69 real differential pairs per linear inch (27 real differential pairs per 10mm) provide higher density than vhdm-hsd bifurcated contact beams in daughtercard receptacle allow greater reliability with two points of contact to header pin modular daughtercard components with gbx l-series available as custom, cost-effective receptacle assemblies optimized differential pair contacts allow easier board trace routing data rate options up to 10.0gbps to support future daughtercard speed upgrades notes: gbx and vhdm-hsd are registered trademarks of teradyne, inc. *in?iband is a registered trademark of the in niband trade association **atca is a trademark of the pci industrial manufacturers group
applications internetworking equipment: - servers, hubs, and routers t elecommunications equipment: - central of?e, cellular infrastructure and multi-platform service (dsl, cable data) systems medical diagnostic equipment t est and measurement equipment ordering information daughtercard assembly 4-pair 5-pair signal wafers, power modules and guide modules sequentially assigned by application 75220-xxxx (wafer 75221-0001 for reference information only) 75360-xxxx (wafer 75361-0001 for reference information only) backplane signal header 4-pair (8 circuits per column)* 5-pair (10 circuits per column)* order no. circuits order no. circuits 10-column open 75235-0104 80 75237-0104 100 25-column open 75235-0204 200 75237-0204 250 10-column guide left 75235-2104 80 75237-2104 100 25-column guide left 75235-2204 200 75237-2204 250 10-column guide right 75235-4104 80 75237-4104 100 25-column guide right 75235-4204 200 75237-4204 250 backplane power and guide components 4-pair 5-pair order no. circuits order no. circuits power 75341-4444 8 75510-4444 10 stand-alone guide pin 75234-0469 75234-0469 americas headquarters lisle, illinois 60532 u.s.a. 1-800-78molex amerinfo@molex.com far east north headquarters yamato, kanagawa, japan 81-462-65-2324 feninfo@molex.com far east south headquarters jurong, singapore 65-6-268-6868 fesinfo@molex.com european headquarters munich, germany 49-89-413092-0 eurinfo@molex.com corporate headquarters 2222 wellington ct. lisle, il 60532 u.s.a. 630-969-4550 fax:630-969-1352 visit our web site at www.molex.com/product/backplan/gbx.html order no. usa-250 printed in usa/2.5k/ji/ji/2004.07 ? 2004, molex 1.85 by 1.85mm (.073 by .073") pitch gbx module-to-backplane connector system in 4- and 5-pair columns 75220, 75360 daughtercard assemblies 75235, 75237 backplane signal headers 75341, 75510 backplane power *note: multiple keying options available. contact molex for details.
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